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aluminum circle

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Aluminum Circle for cookware

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

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Aluminum disc circle for lighting

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Aluminum disc circle for signs

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

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Aluminum disc circle for bottles

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

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Aluminum disc circle for vessels

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

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Custom thickness aluminum disc circle

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Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

al wafer Guinea

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R——_-CSDN_r ...

2020-4-15 · R,,:1.>data() #。> data()Data sets in package 'boot':acme Monthly Excess Returnsaids Delay in AIDS

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Field-Effect Tunneling Transistor Based on Vertical ...

We report an alternative graphene transistor architecture—namely, a field-effect transistor based on quantum tunneling (13–17) from a graphene electrode through a thin insulating barrier [in our case, hexagonal boron nitride (hBN) or disulfide of ~1 nm thickness].The operation of the device relies on the voltage tunability of the tunneling density of states (DOS) in .

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Handbook of Silicon Based MEMS Materials and .

2015-9-2 · The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on .

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Large transport gap modulation in graphene via electric ...

2021-3-15 · Lu, N. et al. Electric-field control of tri-state phase transformation with a selective dual-ion switch. Nature 546, 124–128 (2017). Google Scholar

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WAFER ALTAMIOZ hiring Sales Executive in Al Khobar ...

WAFER ALTAMIOZ Al Khobar, Eastern, Saudi Arabia. Resume Be sure to include an updated resume. ... Get email updates for new Sales Executive jobs in Al Khobar, Eastern, Saudi Arabia.

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Light-promoted synthesis of highly-conjugated crystalline ...

2019-5-29 · Sahabudeen, H. et al. Wafer-sized multifunctional polyimine-based two-dimensional conjugated polymers with high mechanical stiffness. Nat. Commun. 7, 13461 (2016).

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.PDF - BOOK118

2017-10-6 · .PDF, A reliable way of mechanical exfoliation of large scale two dimensional materials with high quality , (1., ...

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Large transport gap modulation in graphene via electric ...

2021-3-15 · Lu, N. et al. Electric-field control of tri-state phase transformation with a selective dual-ion switch. Nature 546, 124–128 (2017). Google Scholar

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FlexAL ALD System - Oxford Instruments - Oxford .

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber. Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber.

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Light-promoted synthesis of highly-conjugated crystalline ...

2019-5-29 · Sahabudeen, H. et al. Wafer-sized multifunctional polyimine-based two-dimensional conjugated polymers with high mechanical stiffness. Nat. Commun. 7, 13461 (2016).

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EKC Post-etch Residue Removers | DuPont

2021-12-15 · EKC® Post-Etch Residue Removers. DuPont's post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes. Post-etch residue removers are part of our EKC Technology portfolio. Those products are designed to clean residues ...

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Download Sapera LT | Teledyne DALSA

One of the world's foremost pure-play MEMS foundries, supporting both 150 mm and 200 mm wafer processes. CCD Fabrication. Industry-leading manufacturing capability for high-performance CCD fabrication processes. Mixed Signal Circuit Design.

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Reactive Ion Etching (RIE) - Oxford Instruments

Reactive Ion Etching (RIE) is a simple operation and an economical solution for general plasma etching. Oxford Instruments provides RIE systems for chemical, ion-induced and physical etching for applications such as semiconductors and failure analysis.

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ULVAC - PVD

SME Series. The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.

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Dynamics of 2D material membranes - IOPscience

2021-8-12 · Readout methods. For studying the dynamics of 2D materials, readout methods for measuring motion w ( x, y, t) and actuation methods for driving the membrane, via the terms and in the EOM, are essential. Due to the high frequencies, small amplitudes and small size of 2D material resonators, accurate readout is challenging.

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- parksystems

2  · NCHR 12M for ATX. 42. 330. Nanosensors. Mounted PPP-NCHR cantilever for industrial systems with ATX. Backside reflex coating. Compatible with standard ATX. Cassette of 12 (EA) Request for Quote.

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Reactive Ion Etching (RIE) - Oxford Instruments

Reactive Ion Etching (RIE) is a simple operation and an economical solution for general plasma etching. Oxford Instruments provides RIE systems for chemical, ion-induced and physical etching for applications such as semiconductors and failure analysis.